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The wireless electronics market has been growing rapidly in conjunction with computer, automotive, biomedical, and military applications. RF integrated-circuit (IC) chips in these areas require greater density, higher speed, lower power, lower cost, and better reliability. However, designing and testing RFIC chips is becoming increasingly more complicated and challenging. In fact, the process of integrating RFICs into SoCs and systems in package (SiPs) has caused a major bottleneck in the production of high-performance systems. Although considerable research is underway to reduce the design and test overhead for RFIC chips, this bottleneck remains the major obstacle to efficient RFIC chip product manufacturing. Therefore, the most critical challenge in creating RFICs today is to develop innovations in design and test methods. IEEE Design & Test seeks original manuscripts for a special issue on the design and test of RFIC chips, scheduled for publication in January-February 2008. We invite submissions of unpublished, original articles that showcase the state of the art in this area for system integration in computers, wireless communication, and automobiles. Topics of interest include, but are not limited to, the following areas:
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Prospective authors should follow the submission guidelines for IEEE Design & Test. All manuscripts must be submitted electronically to the IEEE Manuscript Central Web site at https://mc.manuscriptcentral.com/cs-ieee. Indicate that you are submitting your article to the special issue on “Design and Test of RFIC Chips.” All articles will undergo the standard IEEE Design & Test review process. Submitted manuscripts must not have been previously published or currently submitted for publication elsewhere. Manuscripts must not exceed 5,000 words, including figures (with each average-size figure counting as 150 words) and including a maximum of 12 References (50 for surveys). This amounts to about 4,200 words of text and five figures. Accepted articles will be edited for clarity, structure, conciseness, grammar, passive to active voice, logical organization, readability, and adherence to style. Please see IEEE D&T Author Resources at http://www.computer.org/dt/author.htm, then scroll down and click on Author Center for submission guidelines and requirements. Schedule
Questions Please direct questions regarding this special issue to Guest Editors. Guest Editors:
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